Shenzhen Xinhaisen Technology Limited
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Precision Etched Vapor Chambers for Advanced Thermal Management Solutions
Vapor Chamber Overview
Vapor Chambers are advanced two-phase heat transfer devices designed for efficient thermal management in high-power and space-constrained applications. They provide superior heat dissipation through phase-change principles, making them essential in modern electronics thermal design.
·Ultra-Thin Design: Thickness options as low as 0.3mm.
·High Thermal Conductivity: Up to 5–10 times greater than solid copper.
·Uniform Heat Spreading: Effective full-plane temperature equalization.
·Customizable Shapes: Flexibility in design to fit specific device layouts.
·Lightweight & Durable: Constructed with copper or hybrid materials.
·Precision Etched Structures: Micro-channel and support pillar designs optimized for capillary action and vapor flow.
| Parameter | Value Range |
|---|---|
| Material | Copper, Stainless Steel |
| Max. Size | Up to 400mm x 400mm |
| Operating Temperature | -40°C to 200°C |
| Flatness Tolerance | As fine as 0.03mm |
·Smartphones and Tablets
·Laptops and Ultrabooks
·5G Communication Devices
·LED Lighting Systems
·Automotive Electronics
·UAV and Aerospace Systems·High-Performance Servers and GPUs
·Anti-static and vacuum-sealed packaging per piece
·Placed in foam trays or custom plastic holders
·Standard carton box with dividers for bulk orders
·Custom packaging options available upon request