Shenzhen Xinhaisen Technology Limited
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High Precision Etched Lead Frames Manufacturer ±0.03mm Tolerance ISO Certified
Your Trusted Lead Frame Manufacturing Partner
Xinhsen Tech specializes in high-precision etched lead frames for semiconductor packaging, offering superior alternatives to traditional stamped frames. With ±0.01mm tolerance and 0.02-3.0mm thickness range, our photo chemically etched lead frames deliver unmatched precision for QFN, DFN, QFP, and other advanced IC packages.
Why Choose Our Etched Lead Frames?
Unmatched Precision
Fine-pitch capability down to 0.015mm line width
Multi-tier designs with consistent accuracy (±0.01mm)
Burr-free edges for perfect die attachment
Material Expertise
Copper alloys (C194, C7025) - Optimal conductivity
Kovar/Alloy 42 - Low CTE for sensitive applications
Custom silver/gold plating available
Advanced Manufacturing
Photo chemical etching for complex geometries
Monthly capacity: 1,000,000+ units
5-7 day prototyping for fast NPI
Reliability Assurance
100% automated optical inspection
JEDEC-compliant production standards
Material certifications (SGS, RoHS)
Key Specifications
| Thickness | 0.02-3.0mm |
| Tolerance | ±0.01mm |
| Min. Pitch | 0.1mm |
| Surface Finish | Matte, polished, plated |
| Lead Count | Up to 500 I/Os |
Applications
Power ICs - Superior heat dissipation
LED Packaging - Precise light alignment
MEMS Devices - Ultra-fine features
Automotive Electronics - Vibration-resistant
5G/Wireless ICs - High-frequency performance
Competitive Advantages
30% Cost Savings vs. stamped alternatives
Faster Tooling - No hard tooling required
Design Flexibility - Modify frames without tooling changes
Just-in-Time Delivery - Reliable supply chain
