Shenzhen Xinhaisen Technology Limited
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Overview
Xinhsen Technology specializes in manufacturing high-performance chemically etched electrical connectors for demanding applications across electronics, automotive, aerospace, and industrial sectors. Our precision etching technology enables the production of ultra-fine pitch connectors with exceptional conductivity, durability, and dimensional accuracy that surpass traditional stamped alternatives.
✔ Micro-Precision - Achieves ultra-fine pitch down to 0.1mm with ±0.03mm tolerance
✔ Material Expertise - High-conductivity copper alloys, beryllium copper, and specialty metals
✔ Complex Designs - Intricate contact patterns without tooling limitations
✔ Superior Surface Finish - Smooth, burr-free edges for reliable mating
✔ Cost-Effective - Eliminates expensive stamping dies for prototypes
✔ Rapid Production - Samples in 7 days, mass production scaling
| Parameter | Specification |
| Operating Temp. | -55°C to +150°C (wider ranges available) |
| Current Rating | Up to 20A (material and design dependent) |
| Surface Finish | Gold, Silver, Tin, or Nickel plating options |
| Contact Resistance | <5mΩ (depending on material and plating) |
| Dimensional Tolerance | ±0.03mm (standard), ±0.01mm (high precision) |
| Material Options | C11000 Copper, C17200 Beryllium Copper, Phosphor Bronze, Nickel Silver |
| Thickness Range | 0.05mm - 2.0mm (standard) |
| Contact Pitch | 0.1mm - 5.0mm (customizable) |
• Battery Connectors - High-current contacts for energy storage systems
• FFC/FPC Connectors - Fine-pitch flex circuit interfaces
• Board-to-Board - Precision interconnects for PCBs
• Power Connectors - High-current terminals and busbars
• RF Connectors - Shielded contacts for high-frequency applications
• Custom Spring Contacts - MEMS and micro-switch components
• Consistent Quality: Etching process eliminates stamping variability
• Design Flexibility: No limitations on contact geometry
• Durability: Excellent spring properties (especially BeCu)
• Plating Adhesion: Superior surface for reliable plating bonds
• Miniaturization: Enables ultra-compact connector designs
• ISO 9001:2015 certified manufacturing
• 100% automated optical inspection (AOI)
• Cross-section analysis for critical dimensions
• Continuous plating thickness monitoring
• Mechanical and electrical testing capabilities
