Shenzhen Xinhaisen Technology Limited

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Ultra Thin Vapor Chambers Precision Etching For Superior Thermal Dissipation

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Shenzhen Xinhaisen Technology Limited
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsHaily Huang
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Ultra Thin Vapor Chambers Precision Etching For Superior Thermal Dissipation

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Brand Name :XHS/Customize
Model Number :Customize
Certification :ISO 9001, ISO 14001, IATF 16949
Place of Origin :China
MOQ :20
Price :50-100USD
Payment Terms :T/T
Supply Ability :10000-100000PCD / week
Delivery Time :5-10 work days
Packaging Details :PE bags and Carton
Equipment :Photo etching machine
Complexity :High
Surface Finish :Smooth
Material :Copper alloy
Advantages :High precision, intricate designs, cost-effective
Lead Time :3-5 days
Quality Control :100% inspection
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High Performance Vapor Chambers Precision Etched for Superior Thermal Dissipation

Vapor Chambers Overview

Xinhsen’s vapor chambers are ultra-thin, two-phase heat spreaders designed to efficiently transfer heat away from high-power components like CPUs, GPUs, LED arrays, and 5G modules. Utilizing precision chemical etching, we create optimized wick structures and vapor channels that outperform traditional heat pipes and solid metal heat sinks. Our vapor chambers ensure uniform temperature distribution, lower hotspot temperatures, and compact integration in space-constrained devices.

Key Advantages

Ultra-thin designs (as low as 0.3mm) for slim devices
High thermal conductivity (5-10x better than copper)
Custom wick structures (mesh, groove, sintered powder)
Leak-proof & long lifespan (robust laser welding & sealing)
Lightweight & corrosion-resistant (compatible with various working fluids)

Vapor Chambers Specifications

Parameter Specification
Material Options Copper (C1100/1010), Stainless Steel, Titanium
Thickness Range 0.3mm – 3.0mm
Max Working Temp. -50°C to +150°C (standard)
Thermal Conductivity 500 – 1,500 W/m·K (depends on size/fluid)
Wick Structure Mesh, Grooved, Sintered Powder
Working Fluids Water, Ammonia, Ethanol

Design & Customization Options

  • Shapes: Rectangular, circular, L-shaped, custom cutouts

  • Wick Optimization: Multi-layer wicks for high heat flux zones

  • Fluid Charge: Adjustable for different operating temperatures

  • Attachment Features: Pre-applied thermal interface material (TIM), mounting holes, soldering pads

Performance Data

30% lower thermal resistance vs. solid copper heat spreaders
Hotspot reduction from 100°C to <70°C in typical CPU applications
Uniformity: ±1°C across surface (for high-end electronics)

Applications

Consumer Electronics: Smartphones, laptops, tablets
5G & Telecom: Base stations, RF power amplifiers
Automotive: EV battery cooling, LED headlights
Aerospace: Avionics thermal management
Medical Devices: Laser diode cooling

Quality Assurance

100% pressure & leak testing
Material certifications (RoHS, REACH compliant)
3D X-ray inspection for internal structure integrity
ISO 9001 & IATF 16949 (automotive-grade)

Why Choose Xinhsen Vapor Chambers?

  • Precision etching ensures consistent micro-channel/wick structures

  • Fast prototyping (5-7 days for samples)

  • Mass production capacity: 100,000+ units/month

  • DFM support – Optimize designs for cost & performance

Request a quote today! Provide your thermal requirements for a customized solution.

Ultra Thin Vapor Chambers Precision Etching For Superior Thermal Dissipation

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